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The use of a thermal compound to dissipate heat from the CPU is very important. The gel is usually placed between the CPU and the heat sink to aid in the proper dispersion of heat given off by the CPU. Thermal Gels are normally packed with heat conductive metal oxides, a combination that promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 350 degrees Fahrenheit (177 degrees Celcius), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis of the computer. This increases the overall efficiency of the device and prevents unnecessary overheating.
Thermal Gel And Heat Sink Operation is critical especially if the computer is being used in high temperature areas. Overall, Thermal Gels are suitable for CPU, chipsets on Mainboards, and VGA cards. They are very easy to use and operate effectively at varying temperatures. All this means is that it is imperative that you use thermal gel when installing CPU’s or any other component that generates high temperature. You do not have to do it, but keep in mind that you will severely reduce the life of your processor if it is not used. Your computer will keep shutting down once the critical temperature is reached and eventually result in damage to your computer. Be smart - use a thermal compound between the heat sink and CPU to prolong the life of your CPU and for increased operation of your machine.
